Experience Engineering Expertise. Build Products That Perform.
At Amrita Embedded Systems Private Limited, we transform ideas and industrial requirements into reliable, practical embedded solutions. From hardware and firmware development to IoT, RF, radar and customized embedded systems, our engineering team works with industries to design, develop, prototype and test solutions built for real-world applications.
We bridge the gap between engineering requirement and functional product by working alongside client R&D teams, offering end-to-end capabilities under one roof.
Structured design methodology ensuring rapid delivery with zero compromise on quality.
Avoid multi-vendor friction with integrated PCB, firmware, and wireless engineering.
From sensor interfaces and custom electronics to real-time firmware, FPGA acceleration, and edge-to-cloud AI—we engineer the complete hardware–software stack.
Bare-metal and RTOS firmware, MCU/SoC bring-up, peripheral drivers, communication protocols, and Verilog/VHDL-based DSP pipelines and hardware accelerators.
Digital, analog, RF, and mixed-signal PCB design, sensor integration, wireless connectivity, data acquisition gateways, and device-to-cloud telemetry for connected embedded products.
AI/ML model development and edge inference, real-time object detection and face recognition, machine-vision quality inspection, multi-camera tracking, and ROS 2-based robotics and industrial automation.
System architecture, hardware–firmware co-design, proof-of-concept and MVP development, rapid prototyping, board bring-up, system validation, and design for manufacturability through manufacturing handover.
Based in Hyderabad, Amrita Embedded Systems brings these capabilities together to develop integrated embedded products.
Custom PCB design across specialized domain standards and harsh operational environments.
High-speed MCU boards, memory bus routing, multi-layer stackups, and low-noise power distribution networks.
Precision analog signal conditioning, instrumentation amplifiers, low-noise ADCs, and sensor interfacing circuitry.
Controlled impedance trace routing, RF shielding, antenna matching networks, and Sub-GHz / 2.4GHz RF layout.
Ruggedized design, thermal dissipation management, extreme vibration tolerance, and high-reliability component selection.
CAN/LIN bus controllers, automotive power supply protection, transient voltage suppression, and AEC-Q compliant design.
Delivering deterministic firmware architectures, multi-protocol industrial wireless connectivity, and secure edge-to-cloud IoT ecosystems built for 24/7 reliability.
Production-grade C/C++ firmware development across STM32, NXP, Microchip PIC/AVR, and TI microcontrollers with register-level bare-metal programming and low-latency driver execution.
Multitasking operating environments engineered with FreeRTOS, Zephyr RTOS, and RT-Thread—implementing preemptive task scheduling, thread synchronization, queues, and mutex locks.
Robust wireless sensor node integration using Wi-Fi, BLE 5.x, LoRaWAN, Zigbee, Sub-GHz RF, and NB-IoT/4G cellular modems tailored for distributed edge networks.
Fieldbus and telemetry communications using CAN 2.0B / CAN FD, RS-485, Modbus RTU/TCP, SPI, and I²C for mission-critical integration into industrial automation and factory control equipment.
Deep-sleep profiling, dynamic clock scaling, interrupt-driven event architectures, and battery management circuitry engineered for multi-year field battery lifespans in remote environments.
Custom dual-bank bootloaders supporting cryptographic signature verification and encrypted Firmware-Over-The-Air (FOTA) updates with fallback recovery for zero-downtime maintenance.
From sensor drivers and RTOS tasks to wireless mesh and cloud dashboards, our Hyderabad engineering team builds complete production-ready IoT ecosystems.
Our engineering team has extensive experience across all critical design process activities.
Evaluation of technical feasibility, component availability, lead times, and cost targets before committing to full development.
Optimal hardware-software partitioning to balance processing power, energy consumption, and unit BOM cost.
Comparative trade-off studies for microcontrollers, wireless modules, and sensor components to optimize product unit cost.
Designing for electromagnetic compatibility, ESD immunity, and efficient thermal dissipation as per regulatory standards.
MTBF estimation, environmental strain analysis, and design for field serviceability and long lifecycle deployment.
Guidance and preparation for industrial CE, FCC, RoHS, and BIS certifications for final commercial product rollouts.
Located near major industrial corridors in Hyderabad, providing rapid prototyping and engineering collaboration for regional and global clients.
Schedule an in-person technical discussion with our embedded system architects in Beeramguda, Hyderabad.
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